BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness

Product Categories

HongRuiXing (Hubei) Electronics Co.,Ltd.

Trust Seal

Verified Supplier

Credit Check

Supplier Assessment

Contact Now

HongRuiXing (Hubei) Electronics Co.,Ltd.

Visit Website

City: Shenzhen

Country/Region: China

View Contact Details

BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness

Contact Now

BT ENEPIG 4 Layer Sip Package Substrate 0.24mm Finished Thickness

Application:Sip package substrate,Semiconductor package; Spec.of substrate production: Mini.Line space/width:1mil (25um) Finished thickness:BT (0.1-0.4mm) finished thickness; Material brand:Mainly ...

Product Tags:

4 Layer Sip Package Substrate

BT ENEPIG Sip Package Substrate

0.29mm Finished Package Chip Substrate

Send your message to this supplier


*From:	Your email address is incorrect!
*To:	HongRuiXing (Hubei) Electronics Co.,Ltd.
*Subject:	Subject is empty!
*Message:	For the best results, we recommend including the following details: -Self introduction -Required specifications -Inquire about price/MOQ Characters Remaining: (0/3000) Please enter 20 to 3000 characters to contact this supplier!

Friendly Links: www.everychina.com